[Photo provided by Samsung Electronics Co.]
Samsung Electronics Co. announced Wednesday it has developed High Bandwidth Memory (HBM) embedded with artificial intelligence (AI) processing power for the first time in the world, bringing a paradigm shift in memory chip capacity.
The new processing-in-memory (PIM) architecture brings processing power directly to where the data is stored by placing a DRAM-optimized AI engine inside each memory bank – a storage sub-unit, Samsung Electronics said in a statement.
This enables parallel processing and minimizes data movement, accelerating large-scale processing in data centers, high-performance computing and AI-enabled mobile applications, it added.
Most computing systems currently use separate processor and memory units to carry out intricate data processing tasks. The sequential processing however requires data to move back and forth constantly, causing a system-slowing bottleneck when handling greater volumes of data.
When applied to the existing HBM2 Aquabolt solution, the new architecture is able to deliver twice enhanced system performance while reducing the energy consumption by more than 70 percent. It does not require any hardware or software changes as well, according to the tech giant.
Samsung Electronics recently unveiled a paper on the HBM-PIM technology at the International Solid-State Circuits Virtual Conference (ISSCC).
“Our groundbreaking HBM-PIM is the industry’s first programmable PIM solution tailored for diverse AI-driven workloads such as HPC, training and inference,” said Park Kwang-il, senior vice president for memory product planning at Samsung Electronics.
“We plan to build upon this breakthrough by further collaborating with AI solution providers for even more advance PIM-powered applications.”
Samsung Electronics now is preparing to test the HBM-PIM inside AI accelerators for various clients in the first half of the year.
Samsung Electronics shares fell 2 percent to close at 83,200 won ($75.19) in Seoul trading on Wednesday.
By Lee Ha-yeon
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