Iljin Materials localizes ultra-thin copper foil for chip packaging

2020.10.26 13:15:36 | 2020.10.26 13:16:06

[Photo provided by Iljin Materials]À̹ÌÁö È®´ë

[Photo provided by Iljin Materials]

South Korea¡¯s Iljin Materials has developed a 1.5§­ ultra-thin copper foil for semiconductor packaging, the industry¡¯s thinnest level developed in Korea, the company said on Sunday.

Iljin Materials shares gained nearly 5 percent to trade at 43,200 won ($38.3) as of 11:30 am on Monday.

The producer dedicated to ultra-thin elecfoils as secondary battery materials in electric vehicles said the development marks the first achievement and second only to Japan¡¯s Mitsui in the world.

The company anticipates sales in the new product will be realized from late this year.

The ultra-thin title is given to a thin copper foil whose thickness is less than 2§­, and this is thin enough to be electron transparent.

The thickness of copper foils commonly used for EV batteries is 4.5 to 10§­. Demand for ultra-thin copper foils are on the rise as semiconductor companies has increasingly implemented ultra-fine circuits.

By Shin Soo-hyun and Minu Kim

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