SK Hynix, the world’s second-largest memory chip provider, has developed a chip with the industry’s highest data transfer rates, which can be an optimal memory solution for high-end graphic processing units, machine learning, supercomputers and other latency-sensitive processing.

The company said on Monday that its new High bandwidth memory (HBM) 2E dynamic random-access memory (DRAM) chip whose bandwidth is 50 percent higher than its predecessor supports 460 gigabytes (GB) of data per second based on 3.6 gigabits (Gb)-per-second speed performance capable of transferring data for 124 full-HD movies in a second. The previous model supports 307 GB of data per second.

The company claims that the new chip boasts of the highest data transfer rates.

HBM adds more bandwidth by scaling up resources using TSV (Through Silicon Via) technology. SK Hynix applied this technology to the HBM 2E DRAM to form a single, dense package of 16 GB data capacity by stacking eight 16-Gb chips vertically. It brings more bandwidth and performance for roughly 50 percent less power and less latency with an over 30 percent reduction in size, the company said.

HBM chips are closely interconnected to processors like GPUs with the distance down to a micrometer scale, leading to faster data transfers. The company expects the demand for its new high-performance DRAM chip would rise rapidly from systems supporting machine learning, super computing and artificial intelligence technologies.

SK Hynix showcased its latest HBM solutions during CES 2019 held in the Las Vegas in January.

By Chun Gyung-woon and Minu Kim

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